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LGJ7045TC-D 查看數據表(PDF) - TDK Corporation

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LGJ7045TC-D Datasheet PDF : 12 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
3. SHAPES AND DIMENSIONS
7.2±0.2
Inductance print
Manufacuring number
②①
1.6±0.15
(4.0)
Dimensions in mm
1.6±0.15
No.
ITEM NAME
1
Drum core
2
Ring core
3
Terminals
4
Winding wire
5
Glue
MATERIAL
Ferrite
Ferrite
Tin plated copper(t=0.1)
Polyurethane enameled copper wire
Epoxy resin
Note: 1) Even if the adhesives of an upper surface application have the portion which
has not been buried completely, they presuppose that it is possible.
Note: 2) Values in parentheses are referential.
4. CHARACTERISTICS
Temperature rise
Operating Temperature Range
Storage Temperature Range
Rated current
Application
: 30°C TYP.IDC2)
: -40°C to +150°C (Including Self Temperature Rise)
: -40°C to +150°C
: Please see Section 5-1
Reflow soldering can be used for this product while wave-flow can not be used.
The condition in soldering by hand should confirm to the heat capacitance corresponding to the
test of resistance to soldering heat.
Equivalent Circuit
St.
̶2̶

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