CXA3304N 查看數據表（PDF） - Sony Semiconductor

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CXA3304N

IF IC for ETC

Sony Semiconductor 

Package Outline Unit : mm

CXA3304N

16PIN SSOP (PLASTIC)

∗5.0 ± 0.1

16

9

A

+ 0.2

1.25 – 0.1

0.1

1

+ 0.1

0.22 – 0.05

8

0.65

0.13 M

+ 0.05

0.15 – 0.02

0.1 ± 0.1

0° to 10°

DETAIL A

NOTE: Dimension “∗” does not include mold protrusion.

SONY CODE

EIAJ CODE

JEDEC CODE

SSOP-16P-L01

SSOP016-P-0044

PACKAGE STRUCTURE

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

PACKAGE MASS

EPOXY RESIN

SOLDER / PALLADIUM

PLATING

42/COPPER ALLOY

0.1g

NOTE : PALLADIUM PLATING

This product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame).

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