HI-524_02 查看數據表（PDF） - Intersil

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HI-524_02

4-Channel Wideband and Video M

Intersil 

Die Characteristics

DIE DIMENSIONS:

2250µm x 3720µm x 485µm

METALLIZATION:

Type: CuAl

Thickness: 16kÅ ±2kÅ

Metallization Mask Layout

IN1

SIG

GND

IN2

SIG

GND

FB (OUT)

HI-524

PASSIVATION:

Type: Nitride Over Silox

Nitride Thickness: 3.5kÅ ±1kÅ

Silox Thickness: 12kÅ ±2kÅ

WORST CASE CURRENT DENSITY:

1.58 x 105 A/cm2

HI-524

EN AO

A1

SUPPLY

GND

IN3

SIG

GND

IN4

SIG

GND

SIG

GND

-V FB (IN)

+V OUT

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