AD7778AS 查看數據表（PDF） - Analog Devices

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AD7778AS

LC2MOS, High Speed 1-, 4-, and 8-Channel 10-Bit ADCs

Analog Devices 

AD7776/AD7777/AD7778

ABSOLUTE MAXIMUM RATINGS*

(TA = +25°C unless otherwise noted)

VCC to AGND or DGND . . . . . . . . . . . . . . . . . . –0.3 V, +7 V

AGND, RTN to DGND . . . . . . . . . . . . . –0.3 V, VCC + 0.3 V

CS, RD, WR, CLKIN, DB0–DB9,

BUSY/INT to DGND . . . . . . . . . . . . . –0.3 V, VCC + 0.3 V

Analog Input Voltage to AGND . . . . . . . –0.3 V, VCC + 0.3 V

REFOUT to AGND . . . . . . . . . . . . . . . . –0.3 V, VCC + 0.3 V

REFIN to AGND . . . . . . . . . . . . . . . . . . –0.3 V, VCC + 0.3 V

Operating Temperature Range

All Versions . . . . . . . . . . . . . . . . . . . . . . . . –40°C to +85°C

Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . .+150°C

DIP Package, Power Dissipation . . . . . . . . . . . . . . . . 875 mW

θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 75°C/W

Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260°C

SOIC Packages, Power Dissipation . . . . . . . . . . . . . . 875 mW

θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 75°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C

PQFP Package, Power Dissipation . . . . . . . . . . . . . . 500 mW

θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 95°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C

*Stresses above those listed under absolute maximum ratings may cause permanent

damage to the device. This is a stress rating only; functional operation of the device

at these or any other conditions above those listed in the operational sections of this

specification is not implied. Exposure to absolute maximum rating conditions for

extended periods may affect device reliability.

ORDERING GUIDE

Model

Temperature

Range

AD7776AR

AD7777AN

AD7777AR

AD7778AS

–40°C to +85°C

–40°C to +85°C

–40°C to +85°C

–40°C to +85°C

*R = SOIC, N = PDIP, S = PQFP

No. of

Channels

1

4

4

8

Package

Option*

RW-24

N-28

RW-28

S-44

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection. Although

the AD7776/AD7777/AD7778 feature proprietary ESD protection circuitry, permanent damage

may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD

precautions are recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE

24-Lead SOIC

PIN CONFIGURATIONS

DB0 1

DB1 2

24 CREFIN

23 AGND

DB2 3

22 RTN

DB3 4

21 REFIN

DGND

DB4

DB5

DB6

5

20

6 AD7776 19

TOP VIEW

7 (Not to Scale) 18

8

17

AIN

AGND

REFOUT

VCC

DB7 9

16 CLKIN

DB8 10

15 WR

(MSB) DB9 11

14 CS

BUSY/INT 12

13 RD

28-Lead PDIP and SOIC

DB0 1

DB1 2

28 CREFIN

27 AGND

NC 3

26 RTN

DB2 4

25 REFIN

DB3 5

24 AIN4

DGND 6

23 AIN3

DB4

DB5

DB6

7 AD7777 22 AIN2

8 TOP VIEW 21 AIN1

(Not to Scale)

9

20 AGND

DB7 10

19 REFOUT

DB8 11

(MSB) DB9 12

18 VCC

17 CLKIN

BUSY/INT 13

16 WR

RD 14

15 CS

NC = NO CONNECT

44-Lead PQFP

44 43 42 41 40 39 38 37 36 35 34

NC 1

NC 2

DB2 3

DB3 4

DGND 5

DB4 6

DB5 7

DB6 8

DB7 9

NC 10

NC 11

AD7778

TOP VIEW

(Not to Scale)

33 AIN8

32 AIN7

31 AIN6

30 AIN5

29 AIN4

28 AIN3

27 AIN2

26 AIN1

25 AGND

24 REFOUT

23 VCC

12 13 14 15 16 17 18 19 20 21 22

NC = NO CONNECT

–4–

REV. A

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