MD2S 查看數據表（PDF） - Daesan Electronics Corp.

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MD2S

CURRENT 0.5 Amperes VOLTAGE 50 to 1000 Volts

Daesan Electronics Corp. 

MD1S THRU MD7S

CURRENT 0.5 Amperes

VOLTAGE 50 to 1000 Volts

Features

· Glass Passivated Die Construction

· Diffused Junction

· Low Forward Voltage Drop, High Current Capability

· Surge Overload Rating to 30A Peak

· Designed for Printed Circuit Board Applications

· Plastic Material - UL Flammability Classification 94V-0

L

AB

G

DE

Mechanical Data

· Case : Molded Plastic

· Terminals : Solder Plated Leads,

Solderable per MIL-STD-202, Method 2026

· Polarity : As Marked on Case

· Approx. Weight : 0.125 grams

· Mounting Position : Any

· Marking : Type Number

H

J

K

C

MiniDIP

Dim Min Max

A

5.43 5.75

B

3.60 4.00

C

0.15 0.35

D

0.05 0.20

E

7.00

G

0.70 1.10

H

4.50 4.90

J

2.80 2.90

K

2.50 2.70

L

0.50 0.80

All Dimens ions in mm

Maximum Ratings And Electrical Characteristics

(Ratings at 25℃ ambient temperature unless otherwise specified, Single phase, half wave 60Hz, resistive or inductive

load. For capacitive load, derate by 20%)

Symbols MD1S MD2S MD3S MD4S MD5S MD6S MD7S

Peak Repetitive Reverse voltage

Working Peak Reverse voltage

DC Blocking voltage

RMS Reverse voltage

Maximum DC blocking voltage

Average Rectified Output Current @ TA=40℃

Non-Repetitive Peak Forward Surge Current,

8.3ms single half-sine-wave superimposed

on rated load (JEDEC method)

Forward voltage (per element)

@ IF=0.4 A

Peak Reverse Current at Rated

@ TA=25℃

DC Blocking voltage (per element) @ TA=100℃

Typical Thermal Resistance,

Junction to Ambient (Note 2)

Operating and Storage Temperature Range

VRMM

VRWM

VR

VRMS

VDC

Io

IFSM

VFM

IRM

RθJA

Tj

TSTG

50

100 200 400 600 800 1000

35

70

140 280

420 560

700

50

100 200 400 600 800 1000

0.5

30

1.0

5.0

500

75

-55 to +150

Notes:

(1) Mounted on P.C. Board.

(2) Thermal resistance junction to ambient.

Units

Volts

Volts

Volts

Amp

Amps

Volts

μA

℃/W

℃

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