UPG103A 查看數據表（PDF） - NEC => Renesas Technology
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UPG103A Datasheet PDF : 8 Pages
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µPG103B
RECOMMENDED SOLDERING CONDITIONS
The following conditions (see table below) must be met when soldering this product.
Please consult with our sales offices in case other soldering process is used, or in case soldering is done under
different conditions.
TYPES OF SURFACE MOUNT DEVICE
For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”
(C10535EJ7V0IF00).
µPG103B
Soldering process
Infrared ray reflow
Partial heating method
Soldering conditions
Peak package’s surface temperature: 230 ˚C or below,
Reflow time: 10 seconds or below (210 ˚C or higher),
Number of reflow process: 1, Exposure limit*: None
Terminal temperature: 260 ˚C or below,
Flow time: 10 seconds or below,
Exposure limit*: None
Symbol
*
Exposure limit before soldering after dry-pack package is opened.
Storage conditions: 25 ˚C and relative humidity at 65 % or less.
Note Do not apply more than a single process at once, except for “Partial heating method”.
PRECAUTION This IC must be handled with great care to prevent static discharge because its circuitry is
composed of GaAs MES FET.
Caution
The Grate Care must be taken in dealing with the devices in this guide.
The reason is that the material of the devices is GaAs (Gallium Arsenide), which is
designated as harmful substance according to the Japanese law concerned.
Keep the Japanese law concerned and so on, especially in case of removal.
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