IRFR/U3303PbF
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
V(BR)DSS
∆V(BR)DSS/∆TJ
RDS(on)
VGS(th)
gfs
Parameter
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
Forward Transconductance
IDSS
Drain-to-Source Leakage Current
IGSS
Qg
Qgs
Qgd
td(on)
tr
td(off)
tf
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
LD
Internal Drain Inductance
LS
Internal Source Inductance
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Min. Typ. Max. Units
Conditions
30 V VGS = 0V, ID = 250µA
0.032 V/°C Reference to 25°C, ID = 1mA
0.031 Ω VGS = 10V, ID = 18A
2.0 4.0 V VDS = VGS, ID = 250µA
9.3 S VDS = 25V, ID = 18A
25
250
µA VDS = 30V, VGS = 0V
VDS = 24V, VGS = 0V, TJ = 150°C
100 nA VGS = 20V
-100
VGS = -20V
29
ID = 18A
7.3 nC VDS = 24V
13
VGS = 10V, See Fig. 6 and 13
11
VDD = 15V
99
16
ns
ID = 18A
RG = 13Ω
28
RD = 0.8Ω, See Fig. 10
4.5
Between lead,
D
6mm (0.25in.)
nH from package
G
7.5
and center of die contact
S
750
VGS = 0V
400 pF VDS = 25V
140
= 1.0MHz, See Fig. 5
Source-Drain Ratings and Characteristics
Parameter
IS
Continuous Source Current
(Body Diode)
ISM
Pulsed Source Current
(Body Diode)
VSD
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse RecoveryCharge
ton
Forward Turn-On Time
Min. Typ. Max. Units
Conditions
MOSFET symbol
D
33
A showing the
integral reverse
G
120
p-n junction diode.
S
1.3
53 80
94 140
V TJ = 25°C, IS = 18A, VGS = 0V
ns TJ = 25°C, IF = 18A
nC di/dt = 100A/µs
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Notes:
Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
Starting TJ = 25°C, L = 590µH
RG = 25Ω, IAS = 18A. (See Figure 12)
ISD ≤ 18A, di/dt ≤ 140A/µs, VDD ≤ V(BR)DSS,
TJ ≤ 150°C
Pulse width ≤ 300µs; duty cycle ≤ 2%.
Caculated continuous current based on maximum allowable junction
temperature; Package limitation current = 20A.
This is applied for I-PAK, LS of D-PAK is measured between
lead and center of die contact
www.kersemi.com