HYB5118160BSJ-50 查看數據表（PDF） - Siemens AG

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HYB5118160BSJ-50

1M × 16-Bit Dynamic RAM 1k Refresh (Fast Page Mode)

Siemens AG 

Plastic Package P-TSOPII-50/44-1 (400 mil) (SMD)

(Plastic Thin Small Outline Package (Type II))

15˚±5˚

0.8

0.4

+0.05

-0.1

3)

15˚±5˚

24x 0.8 = 19.2

0.1 50x

0.2 M 50x

50

40 36

26

HYB 5118160BSJ-50/-60

HYB 3118160BSJ-50/-60

1M × 16 DRAM

10.16±0.13 2)

0.5 ±0.1

11.76 ±0.2

1

11 15

25

2.5 max

20.95 ±0.13 1)

Index Marking

1) Does not include plastic or metal protrusion of 0.15 max per side

2) Does not include plastic protrusion of 0.25 max per side

3) Does not include dambar protrusion of 0.13 max per side

GPX05958

Sorts of Packing

Package outlines for tubes, trays etc. are contained in our

Data Book “Package Information”.

SMD = Surface Mounted Device

Semiconductor Group

24

Dimensions in mm

1998-10-01

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