EN5394QI 查看數據表（PDF） - Enpirion, Inc.
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EN5394QI Datasheet PDF : 19 Pages
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Current Derating Curves, EN5394QI, Vin = 3.3V
8x11mm QFN, Tjmax = 125°C, Θ-ja = 16°C/W, No Airflow
9
EN5394QI
Current Derating Curves, EN5394QI, Vin = 5V
8x11mm QFN, Tjmax = 125°C, Θ-ja = 16°C/W, No Airflow
9
8
8
7
7
6
5
55.0
65.0
75.0
Ambient Temp, °C
Vout = 1.0V
Vout = 1.8V
85.0
Vout = 2.5V
Figure 9: Maximum IOUT Curves at VIN = 3.3V
6
5
55.0
Vout = 1.0V
65.0
75.0
Ambient Temp, °C
Vout = 1.8V
Vout = 2.5V
85.0
Vout=3.3V
Figure 10: Maximum IOUT Curves at VIN = 5.0V
Design Considerations for Lead-Frame Based Modules
Exposed Metal on Bottom of Package
Lead-frames offer many advantages in thermal performance, in reduced electrical lead resistance,
and in overall foot print. However, they do require some special considerations.
In the assembly process lead frame construction requires that, for mechanical support, some of the
lead-frame cantilevers be exposed at the point where wire-bond or internal passives are attached.
This results in several small pads being exposed on the package bottom, as shown in Figure 11.
Only the two thermal pads and the perimeter pads are to be mechanically or electrically connected to
the PC board. The PCB top layer under the EN5394QI should be clear of any metal (copper pours,
traces, or vias) except for the two thermal pads. The “grayed-out” area in Figure 11 represents the
area that should be clear of any metal on the top layer of the PCB. Any layer 1 metal under the
grayed-out area runs the risk of undesirable shorted connections even if it is covered by soldermask.
One exposed pad in the grayed-out area can have VIN metal under it as noted in Figure 11.
Figure 12 demonstrates the recommended PCB footprint for the EN5394QI. Figure 13 shows the
package dimensions.
VIN copper covered by
soldermask acceptable
under this exposed pad.
©Enpirion 2009 all rights reserved, E&OE
03738
Figure 11: Lead-Frame exposed metal. Grey
area highlights exposed metal that is not to
be mechanically or electrically connected to
the PCB.
17
8/21/2009
www.enpirion.com
Rev:B
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