ADuM6400/ADuM6401/ADuM6402/ADuM6403/ADuM6404
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications....................................................................................... 1
General Description ......................................................................... 1
Functional Block Diagrams............................................................. 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Electrical Characteristics—5 V Primary Input Supply/
5 V Secondary Isolated Supply ................................................... 3
Electrical Characteristics—3.3 V Primary Input Supply/
3.3 V Secondary Isolated Supply ................................................ 5
Electrical Characteristics—5 V Primary Input Supply/
3.3 V Secondary Isolated Supply ................................................ 6
Package Characteristics ............................................................... 8
Regulatory Information............................................................... 9
Insulation and Safety-Related Specifications............................ 9
Insulation Characteristics.......................................................... 10
Recommended Operating Conditions .................................... 10
Absolute Maximum Ratings.......................................................... 11
ESD Caution................................................................................ 11
Pin Configurations and Function Descriptions ......................... 12
Truth Table .................................................................................. 16
Typical Performance Characteristics ........................................... 17
Terminology .................................................................................... 20
Applications Information .............................................................. 21
PCB Layout ................................................................................. 21
Start-Up Behavior....................................................................... 21
EMI Considerations ................................................................... 22
Propagation Delay Parameters ................................................. 22
DC Correctness and Magnetic Field Immunity..................... 22
Power Consumption .................................................................. 23
Current Limit and Thermal Overload Protection ................. 24
Power Considerations................................................................ 24
Thermal Analysis ....................................................................... 25
Insulation Lifetime ..................................................................... 25
Outline Dimensions ....................................................................... 26
Ordering Guide .......................................................................... 27
REVISION HISTORY
4/12—Rev. 0 to Rev. A
Changes to Features Section, General Description Section,
and Table 1......................................................................................... 1
Changes to Table 2 and Table 3....................................................... 3
Changes to Endnote 1 in Table 5 .................................................... 4
Changes to Table 6 and Table 7....................................................... 5
Change to Propagation Delay Parameter in Table 8 .................... 5
Changes to Endnote 1 in Table 9; Changes to Table 10 ............... 6
Changes to Table 11.......................................................................... 7
Changes to Endnote 1 in Table 13; Changes to Table 14............. 8
Changes to Regulatory Information Section, Table 15,
and Table 16....................................................................................... 9
Changes to Insulation Characteristics Section, Table 17,
and Table 18..................................................................................... 10
Changes to Table 20........................................................................ 11
Changes to Table 26........................................................................ 16
Changes to Figure 13, Figure 14, Figure 15, Figure 17,
and Figure 18................................................................................... 17
Changes to Figure 19 and Figure 20............................................. 18
Added Figure 21 and Figure 22; Renumbered
Figures Sequentially ....................................................................... 18
Added Definition of IISO(LOAD) to Terminology Section.............. 20
Changes to PCB Layout Section ................................................... 21
Added Start-Up Behavior Section................................................ 21
Changes to EMI Considerations Section .................................... 22
Moved Propagation Delay Parameters Section .......................... 22
Changes to Power Consumption Section.................................... 23
Added Current Limit and Thermal Overload Protection
Section.............................................................................................. 24
Moved Thermal Analysis Section ................................................ 25
Changes to Insulation Lifetime Section and Figure 33 ............. 25
Updated Outline Dimensions ....................................................... 26
Changes to Ordering Guide .......................................................... 27
5/09—Revision 0: Initial Version
Rev. A | Page 2 of 28