EHP-A07/SUG01H-P01/TR
High Power LED – 1W
5. Soldering Iron
i. For Reflow Process
a. EHP-A07 series are suitable for SMT process.
b. Curing of glue in oven according to standard operation flow processes.
c. Reflow soldering should not be done more than twice.
d. In soldering process, stress on the LEDs during heating should be avoided.
e. After soldering, do not warp the circuit board.
ii. For Manual Soldering Process
a. For prototype builds or small series production runs it is possible to place and solder the
LED by hand.
b. Dispense thermal conductive glue or grease on the substrates and follow its curing
specifications. Gently press LED housing to closely connect LED and substrate.
c. It is recommended to hand solder the leads with a solder tip temperature of 280°C for
less than 3 second, at a time with a soldering iron of less than 25W. Solder at intervals of
two seconds or more.
d. Take caution and be aware that damaged products are often a result of improper hand
soldering technique.
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