
Package outline - SM-8
ZMT32
Soldering footprint
6.8
0.268
0.95
0.037
4.6
0.181
2.8
0.110
mm
inches
1.52
0.060
DIM
Millimeters
Inches
DIM
Millimeters
Inches
Min. Max. Typ. Min. Max. Typ.
Min. Max. Typ. Min. Max. Typ.
A
-
1.7
-
-
0.067
-
e1
-
A1 0.02 0.1
- 0.0008 0.004
-
e2
-
-
4.59
-
-
1.53
-
- 0.1807
- 0.0602
b
-
-
0.7
-
- 0.0275 He
6.7
7.3
-
0.264 0.287
-
c
0.24 0.32
-
0.009 0.013
-
Lp
0.9
-
-
0.035
-
-
D
6.3
6.7
-
0.248 0.264
-
␣
-
15°
-
-
15°
-
E
3.3
3.7
-
0.130 0.145
-

-
-
10°
-
-
10°
Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches
Issue 1 - June 2008
9
© Zetex Semiconductors plc 2008
www.zetex.com