TS339CN 查看數據表（PDF） - STMicroelectronics

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TS339CN

Micropower Quad CMOS Voltage Comparators

STMicroelectronics 

Package Mechanical Data

4 Package Mechanical Data

TS339

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages.

These packages have a Lead-free second level interconnect. The category of second level

interconnect is marked on the package and on the inner box label, in compliance with JEDEC

Standard JESD97. The maximum ratings related to soldering conditions are also marked on

the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at:

www.st.com.

4.1 DIP14 Package

DIM.

a1

B

b

b1

D

E

e

e3

F

I

L

Z

Plastic DIP-14 MECHANICAL DATA

MIN.

0.51

1.39

1.27

mm.

TYP

0.5

0.25

8.5

2.54

15.24

3.3

MAX.

1.65

20

7.1

5.1

2.54

MIN.

0.020

0.055

0.050

inch

TYP.

0.020

0.010

0.335

0.100

0.600

0.130

MAX.

0.065

0.787

0.280

0.201

0.100

P001A

6/9

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