TL062BIDT 查看數據表（PDF） - STMicroelectronics
零件编号
产品描述 (功能)
生产厂家
TL062BIDT Datasheet PDF : 15 Pages
| |||
Package information
5.1
DIP8 package information
Figure 20. DIP8 package outline
TL062, TL062A, TL062B
Note:
12/15
Table 5.
DIP8 package mechanical data
Dimensions
Symbol
Millimeters
Inches
Min.
Typ.
Max.
Min.
Typ.
Max.
A
5.33
0.210
A1
0.38
0.015
A2
2.92
3.30
4.95
0.115
0.130
0.195
b
0.36
0.46
0.56
0.014
0.018
0.022
b2
1.14
1.52
1.78
0.045
0.060
0.070
c
0.20
0.25
0.36
0.008
0.010
0.014
D
9.02
9.27
10.16
0.355
0.365
0.400
E
7.62
7.87
8.26
0.300
0.310
0.325
E1
6.10
6.35
7.11
0.240
0.250
0.280
e
2.54
0.100
eA
7.62
0.300
eB
10.92
0.430
L
2.92
3.30
3.81
0.115
0.130
0.150
Dimensions "D" and "E1" do not include mold flash, protrusions or gate burrs. Mold flash,
protrusions or gate burrs shall not exceed 0.25 mm in total (both sides). Datum plane "H"
coincides with the bottom of the lead, where the lead exits the body.
Doc ID 2294 Rev 4
Share Link: 