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TJA1040 查看數據表(PDF) - Philips Electronics

零件编号
产品描述 (功能)
生产厂家
TJA1040
Philips
Philips Electronics 
TJA1040 Datasheet PDF : 22 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
Philips Semiconductors
High speed CAN transceiver
Product specification
TJA1040
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX. UNIT
VO(reces)
recessive output voltage
normal mode; VTXD = VCC; 2
0.5VCC 3
V
no load
standby mode; no load 0.1
0
+0.1
V
IO(sc)
short-circuit output current
VTXD = 0 V
pin CANH; VCANH = 0 V 40
70
95
mA
pin CANL; VCANL = 40 V 40
70
100
mA
IO(reces)
recessive output current
27 V < VCAN < +32 V
2.5
Vdif(th)
differential receiver threshold 12 V < VCANL < +12 V;
voltage
12 V < VCANH < +12 V
+2.5
mA
normal mode (see Fig.6) 0.5
0.7
0.9
V
standby mode
0.4
0.7
1.15
V
Vhys(dif)
differential receiver hysteresis normal mode;
50
70
100
mV
voltage
12 V < VCANL < +12 V;
12 V < VCANH < +12 V
ILI
input leakage current
VCC = 0 V;
5
0
+5
µA
VCANH = VCANL = 5 V
Ri(cm)
common-mode input
resistance
standby or normal mode 15
25
35
k
Ri(cm)(m)
common-mode input
resistance matching
VCANH = VCANL
3
0
+3
%
Ri(dif)
differential input resistance standby or normal mode 25
50
75
k
Ci(cm)
common-mode input
capacitance
VTXD = VCC; not tested
20
pF
Ci(dif)
differential input capacitance VTXD = VCC; not tested
10
pF
Timing characteristics; see Fig.8
td(TXD-BUSon)
td(TXD-BUSoff)
td(BUSon-RXD)
td(BUSoff-RXD)
tPD(TXD-RXD)
tdom(TXD)
tBUS
td(stb-norm)
delay TXD to bus active
normal mode
delay TXD to bus inactive
delay bus active to RXD
delay bus inactive to RXD
propagation delay TXD to RXD VSTB = 0 V
TXD dominant time-out
VTXD = 0 V
dominant time for wake-up via standby mode
bus
delay standby mode to normal normal mode
mode
25
70
110
ns
10
50
95
ns
15
65
115
ns
35
100
160
ns
40
255
ns
300
600
1 000
µs
0.75
1.75
5
µs
5
7.5
10
µs
Thermal shutdown
Tj(sd)
shutdown junction temperature
155
165
180
°C
Note
1. All parameters are guaranteed over the virtual junction temperature range by design, but only 100% tested at 125 °C
ambient temperature for dies on wafer level, and in addition to this 100% tested at 25 °C ambient temperature for
cased products; unless specified otherwise. For bare dies, all parameters are only guaranteed with the backside of
the die connected to ground.
2003 Oct 14
7

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