TISP61089S 查看數據表（PDF） - Bourns, Inc

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TISP61089S

DUAL FORWARD-CONDUCTING P-GATE THYRISTORS PROGRAMMABLE OVERVOLTAGE PROTECTORS

Bourns, Inc 

TISP61089 Gated Protector Series

MECHANICAL DATA

D008 Plastic Small-outline Package

This small-outline package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will

withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high

humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly.

D008

4.80 - 5.00

(0.189 - 0.197)

8

7

6

5

8-pin Small Outline Microelectronic Standard

Package MS-012, JEDEC Publication 95

5.80 - 6.20

(0.228 - 0.244)

INDEX

3.81 - 4.00

(0.150 - 0.157)

1.35 - 1.75

(0.053 - 0.069)

1

2

3

4

7 ° NOM

3 Places

0.25 - 0.50

(0.010 - 0.020)

x 45 ° N0M

4.60 - 5.21

(0.181 - 0.205)

0.102 - 0.203

(0.004 - 0.008)

0.28 - 0.79

(0.011 - 0.031)

Pin Spacing

1.27

(0.050)

(see Note A)

6 places

0.36 - 0.51

(0.014 - 0.020)

8 Places

0.190 - 0.229

(0.0075 - 0.0090)

7 ° NOM

4 Places

0.51 - 1.12

(0.020 - 0.044)

DIMENSIONS ARE:

MILLIMETERS

(INCHES)

NOTES: A. Leads are within 0.25 (0.010) radius of true position at maximum material condition.

B. Body dimensions do not include mold flash or protrusion.

C. Mold flash or protrusion shall not exceed 0.15 (0.006).

D. Lead tips to be planar within ±0.051 (0.002).

NOVEMBER 1995 - REVISED AUGUST 2002

Specifications are subject to change without notice.

4°±4°

MDXXAA E

9

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