
Package Outline
Unit: mm
24PIN SOP (PLASTIC)
+ 0.4
15.0 – 0.1
24
13
CXL1511M
+ 0.4
1.85 – 0.15
0.15
+ 0.2
0.1 – 0.05
1
0.45 ± 0.1
12
1.27
+ 0.1
0.2 – 0.05
± 0.12 M
SONY CODE
EIAJ CODE
JEDEC CODE
SOP-24P-L01
∗SOP024-P-0300-A
PACKAGE STRUCTURE
MOLDING COMPOUND EPOXY/PHENOL RESIN
LEAD TREATMENT
SOLDER PLATING
LEAD MATERIAL
COPPER ALLOY / 42ALLOY
PACKAGE WEIGHT
0.3g
– 14 –