TSSOP-16EP 查看數據表（PDF） - Diodes Incorporated.
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TSSOP-16EP Datasheet PDF : 27 Pages
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SUGGESTED PAD LAYOUT
Based on IPC-7351A
X1-DFN1006-2 / X2-DFN1006-2 / MiniMELF / MELF / SOD323 / SOD123 / SOD523 / SMA / SMB / SMC
C
X
Dimensions
X1-DFN1006-2 /
X2-DFN1006-2
MiniMELF
Z
1.1
4.7
G
0.3
2.1
X
0.7
1.7
Y
0.4
1.3
C
0.7
3.5
MELF
6.3
3.3
2.7
1.5
4.8
Y
SOD123
4.9
2.5
0.7
1.2
3.7
G
Z
SOD323
3.75
1.05
0.65
1.35
2.40
SOD523
2.3
1.1
0.8
0.6
1.7
SMA
6.5
1.5
1.7
2.5
4.0
SMB
6.8
1.8
2.3
2.5
4.3
SMC
9.4
4.4
3.3
2.5
6.8
X3-DFN0603-2
X2-DFN0806-3
X1
Z
C
Y (2x)
X (2x)
Dimensions Value (in mm)
C
0.355
X
0.230
Y
0.300
Z
0.610
Y1
Y (2x)
X (2x)
Dimensions
Value
(in mm)
C
0.350
Y2
X
0.200
X1
0.450
X2
0.550
Y
0.375
Y1
0.475
Y2
1.000
C
X2
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 52
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Suggested Pad Layout
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