1112IBZ 查看數據表（PDF） - Intersil
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1112IBZ Datasheet PDF : 14 Pages
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Die Characteristics
DIE DIMENSIONS
63 mils x 44 mils x 19 mils
1600µm x 1130µm 483µm
METALLIZATION
Type: Metal 1: AlCu (2%)/TiW
Thickness: Metal 1: 8kÅ ±0.4kÅ
Type: Metal 2: AlCu (2%)
Thickness: Metal 2: 16kÅ ±0.8kÅ
Metallization Mask Layouts
HFA1112
NC
V-
NC
NC
OUT
HFA1112
PASSIVATION
Type: Nitride
Thickness: 4kÅ ±0.5kÅ
TRANSISTOR COUNT
52
SUBSTRATE POTENTIAL (POWERED UP)
Floating (Recommend Connection to V-)
+IN
-IN
NC
V+
12
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