MLX10410 查看數據表（PDF） - Melexis Microelectronic Systems
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MLX10410 Datasheet PDF : 7 Pages
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Reliability Information
Melexis devices are classified and qualified regarding suitability for infrared, vapor phase and wave
soldering with usual (63/37 SnPb-) solder (melting point at 183degC).
The following test methods are applied:
IPC/JEDEC J-STD-020A (issue April 1999)
Moisture/Reflow Sensitivity Classification For Nonhermetic Solid State Surface Mount Devices
CECC00802 (issue 1994)
Standard Method For The Specification of Surface Mounting Components (SMDs) of Assessed
Quality
MIL 883 Method 2003 / JEDEC-STD-22 Test Method B102
Solderability
For all soldering technologies deviating from above mentioned standard conditions (regarding peak
temperature, temperature gradient, temperature profile etc) additional classification and qualification
tests have to be agreed upon with Melexis.
The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding as-
surance of adhesive strength between device and board.
For more information on manufacturability/solderability see quality page at our website:
http://www.melexis.com/
ESD Precautions
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor products
3M9L0X1011004411008 Fold High Side Driver
Rev. 003
Page 6 Page 6
Rev 1.1 16/AAupgr/012
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