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33079Y 查看數據表(PDF) - STMicroelectronics

零件编号
产品描述 (功能)
生产厂家
33079Y
ST-Microelectronics
STMicroelectronics 
33079Y Datasheet PDF : 12 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
Package information
4
Package information
MC33079
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
4.1
DIP14 package information
Figure 10. DIP14 package mechanical drawing
Table 4.
Ref.
a1
B
b
b1
D
E
e
e3
F
I
DIP14 package mechanical data
Dimensions
Millimeters
Min.
0.51
1.39
Typ.
0.5
0.25
8.5
2.54
15.24
Max.
1.65
20
7.1
5.1
Min.
0.020
0.055
Inches
Typ.
0.020
0.010
0.335
0.100
0.600
Max.
0.065
0.787
0.280
0.201
8/12

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