MC100EP35DG 查看數據表（PDF） - ON Semiconductor

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MC100EP35DG

3.3V / 5VECL JK Flip−Flop

ON Semiconductor 

MC10EP35, MC100EP35

Table 4. MAXIMUM RATINGS

Symbol

Parameter

Condition 1

Condition 2

Rating

Unit

VCC

PECL Mode Power Supply

VEE

NECL Mode Power Supply

VI

PECL Mode Input Voltage

NECL Mode Input Voltage

Iout

Output Current

VEE = 0 V

VCC = 0 V

VEE = 0 V

VCC = 0 V

Continuous

Surge

VI  VCC

VI  VEE

6

V

−6

V

6

V

−6

V

50

mA

100

mA

TA

Operating Temperature Range

Tstg

Storage Temperature Range

qJA

Thermal Resistance (Junction−to−Ambient) 0 lfpm

500 lfpm

8 SOIC

8 SOIC

−40 to +85

−65 to +150

190

130

°C

°C

°C/W

°C/W

qJC

Thermal Resistance (Junction−to−Case)

Standard Board

8 SOIC

qJA

Thermal Resistance (Junction−to−Ambient) 0 lfpm

500 lfpm

8 TSSOP

8 TSSOP

41 to 44

185

140

°C/W

°C/W

°C/W

qJC

Thermal Resistance (Junction−to−Case)

Standard Board

8 TSSOP

qJA

Thermal Resistance (Junction−to−Ambient) 0 lfpm

500 lfpm

DFN8

DFN8

41 to 44

129

84

°C/W

°C/W

°C/W

Tsol

Wave Solder

Pb <2 to 3 sec @ 248°C

Pb−Free <2 to 3 sec @ 260°C

265

°C

265

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

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