MC100EL07DG 查看數據表（PDF） - ON Semiconductor

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MC100EL07DG

5.0 VECL 2-Input XOR/XNOR

ON Semiconductor 

MC10EL07, MC100EL07

Table 1. PIN DESCRIPTION

PIN

D0, D1

Q, Q

VCC

VEE

NC

EP

FUNCTION

ECL Data Inputs

ECL Data Outputs

Positive Supply

Negative Supply

No Connect

Exposed pad must be connected to a

sufficient thermal conduit. Electrically connect

to the most negative supply or leave floating

open.

Table 2. MAXIMUM RATINGS

Symbol

Parameter

Condition 1

Condition 2

Rating

Unit

VCC

PECL Mode Power Supply

VEE = 0 V

VEE

NECL Mode Power Supply

VCC = 0 V

VI

PECL Mode Input Voltage

NECL Mode Input Voltage

VEE = 0 V

VCC = 0 V

Iout

Output Current

Continuous

Surge

TA

Operating Temperature Range

Tstg

Storage Temperature Range

qJA

Thermal Resistance (Junction−to−Ambient) 0 lfpm

500 lfpm

VI  VCC

VI  VEE

SOIC−8

SOIC−8

8

−8

6

−6

50

100

−40 to +85

−65 to +150

190

130

V

V

V

V

mA

mA

°C

°C

°C/W

°C/W

qJC

Thermal Resistance (Junction−to−Case)

Standard Board

SOIC−8

qJA

Thermal Resistance (Junction−to−Ambient) 0 lfpm

500 lfpm

TSSOP−8

TSSOP−8

41 to 44

185

140

°C/W

°C/W

°C/W

qJC

Thermal Resistance (Junction−to−Case)

Standard Board

TSSOP−8

qJA

Thermal Resistance (Junction−to−Ambient) 0 lfpm

500 lfpm

DFN8

DFN8

41 to 44 ± 5%

129

84

°C/W

°C/W

°C/W

Tsol

Wave Solder

Pb <2 to 3 sec @ 248°C

Pb−Free <2 to 3 sec @ 260°C

265

°C

265

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

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