LTC3528B-2
TYPICAL PERFORMANCE CHARACTERISTICS (TA = 25°C unless otherwise noted)
Load Step Response
(3.6V to 5V)
Load Step Response
(1.2V to 3.3V)
VOUT
100mV/DIV
LOAD
CURRENT
200mA/DIV
VIN = 3.6V
VOUT = 5V
COUT = 10µF
L = 2.2µH
20µs/DIV
LOAD CURRENT = 100mA TO 550mA
35282 G22
VOUT
100mV/DIV
LOAD
CURRENT
100mA/DIV
VIN = 1.2V
VOUT = 3.3V
COUT = 10µF
20µs/DIV
L = 2.2µH
LOAD CURRENT = 20mA TO 170mA
35282 G24
PIN FUNCTIONS
SHDN (Pin 1): Logic Controlled Shutdown Input. There is
an internal 4MΩ pull-down resistor on this pin.
• SHDN = High: Normal operation
• SHDN = Low: Shutdown, quiescent current < 1µA
FB (Pin 2): Feedback Input. Connect resistor divider tap
to this pin. The output voltage can be adjusted from 1.6V
to 5.25V by:
VOUT
=
1.20V
•
1+
R2
R1
PGOOD (Pin 3): Power Good Comparator Output. This
open-drain output is low when VFB < 10% from its regu-
lation voltage.
VOUT (Pin 4): Output Voltage Sense and Drain Connection
of the Internal Synchronous Rectifier. PCB trace length
from VOUT to the output filter capacitor (4.7µF minimum)
should be as short and wide as possible.
SW (Pin 5): Switch Pin. Connect inductor between SW
and VIN. Keep PCB trace lengths as short and wide as
possible to reduce EMI. If the inductor current falls to
zero, or SHDN is low, an internal anti-ringing switch is
connected from SW to VIN to minimize EMI.
PGND (Pin 6): Power Ground. Provide a short direct PCB
path between PGND and the (–) side of the input and
output capacitors.
SGND (Pin 7): Signal Ground. Provide a short direct PCB
path between SGND and the (–) side of the input and
output capacitors.
VIN (Pin 8): Battery Input Voltage. Connect a minimum of
1µF ceramic decoupling capacitor from this pin to ground.
GND (Exposed Pad Pin 9): The exposed pad must be
soldered to the PCB ground plane. It serves as another
ground connection and as a means of conducting heat
away from the die.
3528b2fa
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