LT6202C 查看數據表（PDF） - Linear Technology

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LT6202C

Single/Dual/Quad 100MHz, Rail-to-Rail Input and Output, Ultralow 1.9nV/√Hz Noise, Low Power Op Amps

Linear Technology 

LT6202/LT6203/LT6204

PACKAGE DESCRIPTION

Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.

MS8 Package

8-Lead Plastic MSOP

(Reference LTC DWG # 05-08-1660 Rev F)

0.889 ± 0.127

(.035 ± .005)

5.23

(.206)

MIN

3.20 – 3.45

(.126 – .136)

0.42 ± 0.038

(.0165 ± .0015)

TYP

0.65

(.0256)

BSC

RECOMMENDED SOLDER PAD LAYOUT

3.00 ± 0.102

(.118 ± .004)

(NOTE 3)

8 7 65

0.52

(.0205)

REF

0.254

(.010)

DETAIL “A”

0° – 6° TYP

4.90 ± 0.152

(.193 ± .006)

3.00 ± 0.102

(.118 ± .004)

(NOTE 4)

GAUGE PLANE

0.18

(.007)

0.53 ± 0.152

(.021 ± .006)

DETAIL “A”

1 234

1.10

(.043)

MAX

SEATING

PLANE 0.22 – 0.38

NOTE:

1. DIMENSIONS IN MILLIMETER/(INCH)

(.009 – .015)

TYP

0.65

(.0256)

BSC

2. DRAWING NOT TO SCALE

3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.

INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX

0.86

(.034)

REF

0.1016 ± 0.0508

(.004 ± .002)

MSOP (MS8) 0307 REV F

620234fd

23

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