LT3495 查看數據表（PDF） - Linear Technology
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LT3495 Datasheet PDF : 16 Pages
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TYPICAL APPLICATIONS
Wide Input Range SEPIC Converter with 5V Output
INPUT
2.6V TO 12V
C1
2.2μF
L1
10μH
C2
1μF
SW CAP
VCC VOUT
D1
L2
10μH
LT3495B
TURN ON/OFF
SHDN
232k
FB
VOUT DIMMING
CTRL
GND
3495 TA03a
C1: 2.2μF, 16V, X5R, 0805
C2: 1μF, 16V, X5R, 0805
C3: 10μF, 16V, X5R, 1206
D1: FAIRCHILD SEMI MBR0540
L1, L2: COILCRAFT LPS4018-103MLB
C3
10μF
VOUT = 5V
200mA, VIN = 3.3V,
300mA, VIN = 5V,
500mA, VIN = 8V
LT3495/LT3495B/
LT3495-1/LT3495B-1
Efficiency vs Load Current
90
VCC = 3.3V
1200
80
1000
800
70
600
60
400
50
200
40
0.1
1
10
100
LOAD CURRENT (mA)
0
1000
3495 TA03b
PACKAGE DESCRIPTION
DDB Package
10-Lead Plastic DFN (3mm × 2mm)
(Reference LTC DWG # 05-08-1722 Rev Ø)
0.64 ±0.05
(2 SIDES)
2.55 ±0.05
1.15 ±0.05
0.70 ±0.05
0.25 ± 0.05
0.50 BSC
2.39 ±0.05
(2 SIDES)
PACKAGE
OUTLINE
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
0.200 REF
3.00 ±0.10
(2 SIDES)
R = 0.05
TYP
R = 0.115
TYP
6
0.40 ± 0.10
10
2.00 ±0.10
(2 SIDES)
0.75 ±0.05
0.64 ± 0.05
(2 SIDES)
5
0.25 ± 0.05
PIN 1
R = 0.20 OR
0.25 × 45°
CHAMFER
1
(DDB10) DFN 0905 REV Ø
0.50 BSC
0 – 0.05
2.39 ±0.05
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING CONFORMS TO VERSION (WECD-1) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
3495b1b1f
15
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