ISP1102 查看數據表（PDF） - Philips Electronics
零件编号
产品描述 (功能)
生产厂家
ISP1102 Datasheet PDF : 23 Pages
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Philips Semiconductors
Contents
1
General description . . . . . . . . . . . . . . . . . . . . . . 1
2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
4
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
5
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
6
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
6.1
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
6.2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
7
Functional description . . . . . . . . . . . . . . . . . . . 5
7.1
Function selection. . . . . . . . . . . . . . . . . . . . . . . 5
7.2
Operating functions. . . . . . . . . . . . . . . . . . . . . . 5
7.3
Power supply configurations . . . . . . . . . . . . . . . 5
7.4
Power supply input options . . . . . . . . . . . . . . . . 7
8
Electrostatic discharge (ESD). . . . . . . . . . . . . . 8
8.1
ESD protection . . . . . . . . . . . . . . . . . . . . . . . . . 8
8.2
ESD test conditions . . . . . . . . . . . . . . . . . . . . . 8
9
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 9
10
Recommended operating conditions. . . . . . . . 9
11
Static characteristics. . . . . . . . . . . . . . . . . . . . . 9
12
Dynamic characteristics . . . . . . . . . . . . . . . . . 12
13
Test information . . . . . . . . . . . . . . . . . . . . . . . . 15
14
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16
15
Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
16
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
16.1
Introduction to soldering surface mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
16.2
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 19
16.3
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 19
16.4
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 20
16.5
Package related soldering information . . . . . . 20
17
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 21
18
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 22
19
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
20
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
ISP1102
Advanced USB transceiver
© Koninklijke Philips Electronics N.V. 2003.
Printed in The Netherlands
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.
The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.
Date of release: 02 September 2003
Document order number: 9397 750 11228
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