
Die Characteristics
DIE DIMENSIONS:
Analog: 3070mm x 4610mm
Digital: 1900mm x 4510mm
METALLIZATION:
Digital Type: Nitrox
Thickness: 10kÅ ±2kÅ
Metal 1: AlSiCu
Thickness: 8kÅ ±1kÅ
Metal 2: AlSiCu
Thickness: 16kÅ ±2kÅ
Analog Type: Al
Thickness: 16kÅ ±2kÅ
Metallization Mask Layout
HI-574A, HI-674A, HI-774
PASSIVATION:
Type: Nitride Over Silox
Nitride Thickness: 3.5kÅ ±0.5kÅ
Silox Thickness: 12kÅ ±1.5kÅ
WORST CASE CURRENT DENSITY:
1.3 x 105 A/cm2
HI-574A, HI-674A, HI-774
R/C
CE
VCC
VREFOUT
ANALOG
COMMON
ANALOG
COMMON
ANALOG
COMMON
VREFIN
VEE
DB10
DB9
DB8
DB7
DB6
DB5
DB4
DB3
DB2
6-968