HI-8482PSI(2001) 查看數據表（PDF） - Holt Integrated Circuits
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HI-8482PSI Datasheet PDF : 10 Pages
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HI-8482
THERMAL CHARACTERISTICS
PACKAGE
DESCRIPTION
PLASTIC SMALL OUTLINE (SOIC)
PLASTIC J-LEAD PLCC
CERDIP
CERAMIC SIDE-BRAZED DIP
CERAMIC J-LEAD CERQUAD
CERAMIC LCC
THERMAL
RESISTANCE
JC
JA
17°C/W
90°C/W
30°C/W
85°C/W
28°C/W
90°C/W
28°C/W
95°C/W
25°C/W
95°C/W
25°C/W
85°C/W
ORDERING INFORMATION
PART
NUMBER
HI-8482C
HI-8482CT
HI-8482CM-01
HI-8482D
HI-8482DT
HI-8482J
HI-8482JT
HI-8482PSI
HI-8482PST
HI-8482S
HI-8482ST
HI-8482SM-01
HI-8482U
HI-8482UT
PACKAGE
DESCRIPTION
20 PIN CERAMIC SIDE BRAZED DIP
20 PIN CERAMIC SIDE BRAZED DIP
20 PIN CERAMIC SIDE BRAZED DIP
20 PIN CERDIP
20 PIN CERDIP
20 PIN PLASTIC J -LEAD PLCC
20 PIN PLASTIC J -LEAD PLCC
20 PIN PLASTIC SMALL OUTLINE (SOIC)
20 PIN PLASTIC SMALL OUTLINE (SOIC)
20 PIN CERAMIC LEADLESS CHIP CARRIER
20 PIN CERAMIC LEADLESS CHIP CARRIER
20 PIN CERAMIC LEADLESS CHIP CARRIER
20 PIN J-LEAD CERQUAD
20 PIN J-LEAD CERQUAD
TEMPERATURE
RANGE
-40°C TO +85°C
-55°C TO +125°C
-55°C TO +125°C
-40°C TO +85°C
-55°C TO +125°C
-40°C TO +85°C
-55°C TO +125°C
-40°C TO +85°C
-55°C TO +125°C
-40°C TO +85°C
-55°C TO +125°C
-55°C TO +125°C
-40°C TO +85°C
-55°C TO +125°C
BURN LEAD
FLOW IN FINISH
I
NO GOLD
T
NO GOLD
M YES SOLDER
I
NO SOLDER
T
NO SOLDER
I
NO SOLDER
T
NO SOLDER
I
NO SOLDER
T
NO SOLDER
I
NO GOLD
T
NO GOLD
M YES SOLDER
I
NO SOLDER
T
NO SOLDER
HOLT INTEGRATED CIRCUITS
7
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