HI-3182CR-M 查看數據表（PDF） - Holt Integrated Circuits
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HI-3182CR-M Datasheet PDF : 12 Pages
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HI-318X PACKAGE DIMENSIONS
14-PIN PLASTIC SMALL OUTLINE (ESOIC) - NB
(Narrow Body, Thermally Enhanced)
.341 ± .004
(8.65 ± .10)
.0085 ± .001
(.220 ± .029)
.236 ± .008
(6.00 ± .20)
Top View
.153 ± .003
(3.87 ± .06)
.100 typ
(2.54)
inches (millimeters)
Package Type: 14HNE
.270 typ
(6.86)
Bottom
View
.0165 ± .003
(.419 ± .089)
.050 BSC
(1.27)
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
See Detail A
.055 ± .005
(1.397 ± .13)
Electrically isolated heat sink
pad on bottom of package.
Connect to any ground or
power plane for optimum
thermal dissipation.
0° to 8°
.033 ± .017
(.838 ± .43)
.0025 ± .0015
(.0635 ± .04)
Detail A
16-PIN PLASTIC SMALL OUTLINE (ESOIC) - NB
(Narrow Body, Thermally Enhanced)
.390 ± .004
(9.90 ± .10)
.0086 ±
.0015
.236 ±.008
(5.99 ±.20)
Top View
.1525 ± .003
(2.87 ± .06)
.10
(2.54)
typ
inches (millimeters)
Package Type: 16HNE
.270
(6.86)
typ
Bottom
View
.0165 ± .003
(.419 ± .09)
.050
(1.27)
BSC
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
See Detail A
.061 ± .007
(1.55 ± .18)
Electrically isolated heat sink
pad on bottom of package.
Connect to any ground or
power plane for optimum
thermal dissipation.
0° to 8°
.033 ± .017 Detail A
(.838 ± .43)
.0025 ± .0015
(.0635 ± .04)
HOLT INTEGRATED CIRCUITS
9
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