GS816273CGC-300I 查看數據表（PDF） - Giga Semiconductor

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GS816273CGC-300I

256K x 72 18Mb S/DCD Sync Burst SRAMs

Giga Semiconductor 

Preliminary

GS816273CC-333/300/250

A

aaa

209 BGA Package Drawing (Package C)

14 mm x 22 mm Body, 1.0 mm Bump Pitch, 11 x 19 Bump Array

C A1

D

D1

Side View

e

Bottom View

∅b

e

Symbol

Min

Typ

Max Units Symbol

Min

Typ

Max

Units

A

—

—

1.70

mm

D1

—

18.0 (BSC)

—

mm

A1

0.40

0.50

0.60

mm

E

13.9

14.0

14.1

mm

∅b

0.50

0.60

0.70

mm

E1

—

10.0 (BSC)

—

mm

c

0.31

0.36

0.38

mm

e

—

1.00 (BSC)

—

mm

D

21.9

22.0

22.1

mm

aaa

—

0.15

—

mm

Rev 1.0

Rev: 1.01a 6/2006

26/28

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

© 2005, GSI Technology

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