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FPF2312 查看數據表(PDF) - Fairchild Semiconductor

零件编号
产品描述 (功能)
生产厂家
FPF2312
Fairchild
Fairchild Semiconductor 
FPF2312 Datasheet PDF : 17 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-
ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi-
tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The
absolute maximum ratings are stress ratings only.
Symbol Parameter
IN, OUTA, OUTB, ON to GND
PD
TSTG
ΘJA
ESD
Power Dissipation
Storage Temperature
Thermal Resistance, Junction-to-Ambient
Electrostatic Discharge Protection
Human Body Model, JESD22-A114
Charged Device Model, JESD22-C101
Min.
-0.3
-65
4000
2000
Max.
6.0
0.6(1.)
2.2(2.)
+150
216(1.)
57(2.)
Unit
V
W
°C
°C/W
V
V
Notes:
1. Soldered thermal pad on a two-layer PCB without vias based on JEDEC STD 51-3.
2. Soldered thermal pad on a four-layer PCB without vias connected with GND plane based on JEDEC STD51-5, 7.
Recommended Operating Range
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to absolute maximum ratings.
Symbol
IN
TA
Parameter
Supply Input
Ambient Operating Temperature
Min.
1.8
-40
Max.
5.5
+85
Unit
V
°C
© 2009 Fairchild Semiconductor Corporation
FPF2310/12/13/13L • Rev. 1.1.3
4
www.fairchildsemi.com

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