1511CL 查看數據表（PDF） - Intersil

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1511CL

Medium Power Differential Line Driver

Intersil 

EL1511

performance section of the data sheet. When driving a load,

a large portion (about 50%) of the quiescent current

becomes output load current:

PD = 12 × (6.6mA × 50% ) + (12V – 2 × 0.705 ) × 28.2mA

where:

PD = 338mW

Assuming a maximum ambient temperature of 85°C and

keeping the junction temperature less than 150°C, the

maximum thermal resistance from junction to ambient

required is:

ΘJA

=

1----5---0-----–-----8---5--

338 m W

=

192 ° C / W

With proper layout, the EL1511CS package can achieve

47°C/W, well below the thermal resistance required by the

application.

TX+

+ VS+

RT

From

-

VS-

RF

12.5

TXFR

1:2

AFE

1.5k

100

2RG

464

TX-

+ VS+

RT

-

VS-

RF

12.5

1.5k

PCB Layout Considerations for Thermal Packages

The EL1511 die is packaged in two different thermal efficient

packages, the 16 Ld SO and 16 Ld QFN packages. The 16

Ld SO package has the same dimensions as standard 0.15"

wide narrow body 16 Ld SO package with a special fused

lead frame that extends out through the center ground pins.

Both packages can use PCB surface metal vias areas and

internal ground planes, to spread heat away from the

package. The larger the PCB area the lower the junction

temperature of the device will be. In XDSL applications,

multiple layer circuit boards with internal ground plane are

generally used. 13 mil vias are recommended to connect the

metal area under the device with the internal ground plane.

Examples of the PCB layouts are shown in the figures below

that result in thermal resistance θJA of 37°C/W for the QFN

package and 47°C/W for the SO package. The thermal

resistance is obtained with the EL1511CL and CS demo

boards. The demo board is a 4-layer board built with 2oz.

copper and has a dimension of 4in2. Note, the user must

follow the thermal layout guideline to achieve these results.

A separate Application Note for the QFN package and layout

recommendations is also available.

TOP (16 Ld QFN)

INTERNAL GROUND PLANE (16 Ld QFN)

TOP (16 Ld SO)

INTERNAL GROUND PLANE (16 Ld SO)

15

FN7016.2

April 10, 2007

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