Typical Performance Curves (Continued)
EL1511
100
IB-
10
eN
IB+
1
10 100
1K 10K 100K 1M 10M 100M
FREQUENCY (Hz)
FIGURE 49. VOLTAGE AND CURRENT NOISE vs FREQUENCY
10M
50
1M
100k
GAIN
PHASE
0
-50
-100
10k
-150
-200
1k
-250
100
-300
100 1K 10K 100K 1M 10M 100M
FREQUENCY (Hz)
FIGURE 51. TRANSIMPEDANCE (ROL) vs FREQUENCY
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY (4-LAYER) TEST BOARD, QFN EXPOSED
DIEPAD SOLDERED TO PCB PER JESD51-5
4
3.5 3.125W
3
2.5
2
1.5
40°QCF/WN16
1
0.5
0
0
25
50
75 85 100 125 150
AMBIENT TEMPERATURE (°C)
FIGURE 53. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
100
VS=±6V
AV=1
10 RF=1.5kΩ
1
0.1
0.01
0.001
10K
100K
1M
10M
FREQUENCY (Hz)
100M
FIGURE 50. OUTPUT IMPEDANCE vs FREQUENCY (ALL
POWER LEVELS)
USING EL1511CS/EL1511CL DEMOBOARD,
2”X2” (4-LAYER) DEMOBOARD WITH
HEATSINK VIA INTERNAL GROUND PLANE
4
3.5 37°C/W
3
47°C/W
2.5
2
1.5
1
QFN16
SO16 (0.150”)
0.5
0
-40 -20 0
20 40 60 80 100
AMBIENT TEMPERATURE (°C)
FIGURE 52. PACKAGE POWER DISSIPATION AND THERMAL
RESISTANCE
13
FN7016.2
April 10, 2007