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E693AHJ 查看數據表(PDF) - Semtech Corporation

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E693AHJ Datasheet PDF : 11 Pages
1 2 3 4 5 6 7 8 9 10
EDGE HIGH-PERFORMANCE PRODUCTS
Application Information
Edge693
Thermal Information
Parameter
Thermal Resistance
Junction to Case
Junction to Air
Still Air
50 LFPM
400 LFPM
Symbol
Min
θJC
θJA
θJA
θJA
Typ
Max
Units
13
oC/W
49
oC/W
36
oC/W
26
oC/W
Thermal equilibrium is established by applying power for at least 2 minutes while maintaining a transverse
air flow of 400 linear feet per minute over the device mounted either in the test socket or on the printed
circuit board. Thermal resistance measurements are taken with device soldered to PCB.
2000 Semtech Corp.
6
www.semtech.com

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