DS1339U-2(2011) 查看數據表（PDF） - Maxim Integrated
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DS1339U-2 Datasheet PDF : 20 Pages
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DS1339 I2C Serial Real-Time Clock
ABSOLUTE MAXIMUM RATINGS
Voltage Range on Any Pin Relative to Ground………………………………………………………………-0.3V to +6.0V
Operating Temperature Range (Noncondensing)………………………………………………………….-40°C to +85°C
Storage Temperature Range………………………………………………………………………………..-55°C to +125°C
Lead Temperature (soldering, 10s)...…………………………………………………………………………………+260°C
Soldering Temperature (reflow).……………………………………………………………………………………….+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is
not implied. Exposure to the absolute maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
µSOP
Junction-to-Ambient Thermal Resistance (θJA).…………………...……………………………………….206.3°C/W
Junction-to-Case Thermal Resistance (θJC)……………………………………………………………………42°C/W
SO
Junction-to-Ambient Thermal Resistance (θJA).……………………………………………………………….73°C/W
Junction-to-Case Thermal Resistance (θJC)……………………………………………………………………23°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
RECOMMENDED DC OPERATING CONDITIONS
(TA = -40°C to +85°C) (Note 2)
PARAMETER
SYMBOL CONDITIONS
Supply Voltage
DS1339-2
VCC
DS1339-3
DS1339-33
Backup Supply Voltage
VBACKUP
Logic 1
VIH
Logic 0
Power-Fail Voltage
VIL
DS1339-2
VPF
DS1339-3
DS1339-33
MIN
1.8
2.7
2.97
1.3
0.7 x
VCC
-0.3
1.58
2.45
2.70
TYP
2.0
3.0
3.3
3.0
1.70
2.59
2.85
MAX
5.5
5.5
5.5
3.7
VCC +
0.3
+0.3 x
VCC
1.80
2.70
2.97
UNITS
V
V
V
V
V
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