
Package Outline
Unit: mm
28PIN SOP (PLASTIC) 375mil
+ 0.4
18.8 – 0.1
28
15
CXA2119M
+ 0.4
2.3 – 0.15
0.15
+ 0.2
0.1 – 0.05
1
0.45 ± 0.1
14
1.27
+ 0.1
0.2 – 0.05
± 0.12 M
SONY CODE
EIAJ CODE
JEDEC CODE
SOP-28P-L04
∗SOP028-P-0375-D
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE WEIGHT
EPOXY / PHENOL RESIN
SOLDER PLATING
42 ALLOY
0.7g
–9–