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BD6762FV 查看數據表(PDF) - ROHM Semiconductor

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BD6762FV Datasheet PDF : 23 Pages
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BD6761FS,BD6762FV
Technical Note
Notes for use
(1) Absolute maximum ratings
This product is subject to a strict quality management regime during its manufacture. Use of the IC in excess of absolute
maximum ratings such as the applied voltage or operating temperature range may result in IC damage. Assumptions
should not be made regarding the state of the IC (short mode or open mode) when such damage is suffered. A physical
safety measure such as a fuse should be implemented when use of the IC in a special mode where the absolute
maximum ratings may be exceeded is anticipated.
(2) Connecting the power supply connector backward
Connecting the power supply connector backwards may result in damage to the IC. For the protection of the IC from
reversed connections, provide an appropriate measure, such as the insertion of an external diode each between the
power supply and the power supply pin of the IC and between the motor coils.
(3) Power supply lines
The regenerated current resulting from the back EMF of the motor will return. Therefore, take an appropriate measure,
such as the insertion of a capacitor between the power supply and GND. Determine the capacitance in full consideration
of all the characteristics of the electrolytic capacitor, because the electrolytic capacitor may loose some capacitance at
low temperatures. If the connected power supply does not have sufficient current absorption capacity, regenerative
current will cause the voltage on the power supply line to rise, which combined with the product and its peripheral
circuitry may exceed the absolute maximum ratings. It is recommended to implement a physical safety measure such as
the insertion of a voltage clamp diode between the power supply and GND pins.
(4) GND potential
Ensure a minimum GND pin potential in all operating conditions.
(5) Setting of heat
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating
conditions.
(6) Pin shorts and mistake fitting
Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result
in damage to the IC. Shorts between output pins or between output pins and the power supply and GND pins caused by
the presence of a foreign object may result in damage to the IC.
(7) Actions in strong magnetic field
Use caution when using the IC in the presence of a strong magnetic field as doing so may cause the IC to malfunction.
(8) ASO
When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.
(9) Thermal shutdown circuit (TSD)
This IC incorporates a TSD circuit. If the chip becomes the following temperature, coil output to the motor will be open.
The TSD circuit is designed only to shut the IC off to prevent runaway thermal operation. It is not designed to protect the
IC or guarantee its operation. Do not continue to use the IC after operating this circuit or use the IC in an environment
where the operation of the TSD circuit is assumed.
BD6761FS
TSD on temperature [°C]
(Typ.)
175
Hysteresis temperature [°C]
(Typ.)
35
BD6762FV
175
23
(10) PWM drive
Voltage between the output FET drain and source may exceed the absolute maximum ratings due to the fluctuation of
VCC at the time of PWM driving. If there is the threat of this problem, it is recommended to take physical
countermeasures for safety such as inserting the capacitor between the VCC pin of FET and the detection resistor pin.
(11) Testing on application boards
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to
stress. Always discharge capacitors after each process or step. Ground the IC during assembly steps as an antistatic
measure, and use similar caution when transporting or storing the IC. Always turn the IC's power supply off before
connecting it to or removing it from a jig or fixture during the inspection process.
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© 2010 ROHM Co., Ltd. All rights reserved.
20/22
2010.06 - Rev.A

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