APBL3025SGYC
SMT Reflow Soldering Instruction
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
SPEC NO: DSAB1397
APPROVED : J. Lu
REV NO: V.1
CHECKED :Allen Liu
DATE:APR/19/2002
DRAWN: M.C.YANG
PAGE: 4 OF 4