ADT7481
ON-CHIP
TEMPERATURE
SENSOR
D1+ 2
D1− 3
D2+ 7
D2− 6
ANALOG
MUX
CONVERSION RATE
REGISTER
LOCAL TEMPERATURE
VALUE REGISTER
11-BIT A-TO-D
CONVERTER
BUSY RUN/STANDBY
REMOTE 1 AND 2 TEMP
VALUE REGISTER
REMOTE 1 AND 2 TEMP
OFFSET REGISTER
EXTERNAL DIODE OPEN-CIRCUIT
STATUS REGISTERS
ADT7481
SMBUS INTERFACE
1
5
VDD
GND
9
SDATA
10
SCLK
Figure 1. Functional Block Diagram
ADDRESS POINTER
REGISTER
ONE-SHOT
REGISTER
LOCAL TEMPERATURE
THERM LIMIT REGISTER
LOCAL TEMPERATURE
LOW LIMIT REGISTER
LOCAL TEMPERATURE
HIGH LIMIT REGISTER
REMOTE 1 & 2 TEMP.
THERM LIMIT REG.
REMOTE 1 & 2 TEMP.
LOW LIMIT REGISTERS
REMOTE 1 & 2 TEMP.
HIGH LIMIT REGISTERS
CONFIGURATION
REGISTER
INTERRUPT
MASKING
4
THERM
8
ALERT/THERM2
Table 1. ABSOLUTE MAXIMUM RATINGS
Parameter
Rating
Unit
Positive Supply Voltage (VDD) to GND
D+
D− to GND
−0.3 to +3.6
V
−0.3 to VDD + 0.3
V
−0.3 to +0.6
V
SCLK, SDATA, ALERT, THERM
−0.3 to +3.6
V
Input Current, SDATA, THERM
Input Current, D−
−1 to +50
mA
±1
mA
ESD Rating, All Pins (Human Body Model)
1,500
V
Maximum Junction Temperature (TJ MAX)
Storage Temperature Range
150
°C
−65 to +150
°C
IR Reflow Peak Temperature
220
°C
IR Reflow Peak Temperature for Pb-Free
260
°C
Lead Temperature, Soldering (10 sec)
300
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
NOTE: This device is ESD sensitive. Use standard ESD precautions when handling.
Table 2. THERMAL CHARACTERISTICS
Package Type
10-lead MSOP
qJA
qJC
Unit
142
43.74
°C/W
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