ADT7408CCPZ-REEL7 查看數據表（PDF） - Analog Devices

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ADT7408CCPZ-REEL7

±2°C Accurate, 12-Bit Digital Temperature Sensor

Analog Devices 

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

VDD to VSS

SDA Input Voltage to VSS

SDA Output Voltage to VSS

SCL Input Voltage to VSS

EVENT# Output Voltage to VSS

Operating Temperature Range

Storage Temperature Range

Maximum Junction Temperature, TJMAX

Thermal Resistance1

θJA, Junction-to-Ambient (Still Air)

IR Reflow Soldering Profile

–0.3 V to +7 V

–0.3 V to VDD + 0.3 V

–0.3 V to VDD + 0.3 V

–0.3 V to VDD + 0.3 V

–0.3 V to VDD + 0.3 V

–55°C to +150°C

–65°C to +160°C

150°C

85oC/W

Refer to Figure 3

1 Power Dissipation PMAX = (TJMAX − TA)/θJA, where TA is the ambient

temperature. Thermal resistance value relates to the package being used on

a standard 2-layer PCB, which gives a worst-case θJA. Some documents may

publish junction-to-case thermal resistance θJC, but it refers to a component

that is mounted on an ideal heat sink. As a result, junction-to-ambient

thermal resistance is more practical for air-cooled, PCB-mounted

components.

ADT7408

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

RAMP UP

3°C/SECOND MAX

217°C

60 – 150 SECONDS

260 – 5/+0°C

150°C – 200°C

RAMP DOWN

6°C/SECOND

MAX.

TIME (Seconds)

60 – 180 SECONDS

480 SECONDS MAX.

20 – 40 SECONDS

Figure 3. LFCSP Pb-Free Reflow Profile Based on JEDEC J-STD-20C

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on

the human body and test equipment and can discharge without detection. Although this product features

proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy

electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degrada-

tion or loss of functionality.

Rev. 0 | Page 5 of 24

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