ADSP-21364(RevA) 查看數據表（PDF） - Analog Devices

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ADSP-21364
(Rev.:RevA)

SHARC® Processor

Analog Devices 

ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366

OUTLINE DIMENSIONS

The ADSP-2136x is available in a 136-ball BGA package.

12.00 BSC SQ

PIN A1 INDICATOR

1.70

MAX

TOP VIEW

0.80

BSC

TYP

A

B

C

D

E

F

G

H

J

K

L

M

N

P

10.40 BSC SQ

14 13 12 11 10 9 8 7 6 5 4 3 2 1

BOTTOM VIEW

DETAIL A

0.80

BSC

TYP

0.25

1. DIMENSIONS ARE IN MILIMETERS (MM).

MIN

2. THE ACTUAL POSITION OF THE BALL GRID IS

WITHIN 0.15 MM OF ITS IDEAL POSITION RELATIVE

TO THE PACKAGE EDGES.

3. COMPLIANT TO JEDEC STANDARD MO-205-AE, EXCEPT FOR

THE BALL DIAMETER.

4. CENTER DIMENSIONS ARE NOMINAL.

0.50

0.45

0.40

(BALL

DIAMETER)

DETAIL A

SEATING

PLANE

0.12 MAX (BALL

COPLANARITY)

Figure 45. 136-Ball Chip Scale Package Ball Grid Array [CSP_BGA](BC-136-2)

SURFACE MOUNT DESIGN

Table 44 is provided as an aide to PCB design. For industry-

standard design recommendations, refer to IPC-7351, Generic

Requirements for Surface Mount Design and Land Pattern

Standard.

Table 44. BGA Data for Use with Surface Mount Design

Package

136-Ball Grid Array (BC-136-2)

Ball Attach Type

Solder Mask Defined

Solder Mask Opening

0.40 mm diameter

Ball Pad Size

0.53 mm diameter

Rev. A | Page 51 of 52 | December 2006

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