ADSP-21061/ADSP-21061L
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
Plastic Ball Grid Array (PBGA)
0.791 (20.10)
0.787 (20.00)
0.783 (19.90)
0.101 (2.57)
0.091 (2.32)
0.081 (2.06)
0.913 (23.20)
0.906 (23.00)
0.898 (22.80)
TOP VIEW
0.791 (20.10)
0.787 (20.00)
0.783 (19.90)
0.913 (23.20)
0.906 (23.00)
0.898 (22.80)
0.700
(17.78)
BSC
0.050
(1.27)
BSC
15141312 1110 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
DETAIL A
0.026 (0.65)
0.024 (0.61)
0.022 (0.57)
0.050 (1.27) BSC
0.700 (17.78) BSC
DETAIL A
0.051 (1.30)
0.047 (1.20)
0.043 (1.10)
NOTE
THE ACTUAL POSITION OF THE BALL GRID IS WITHIN
SEATING
PLANE
0.012 (0.30) OF ITS IDEAL POSITION RELATIVE TO THE PACKAGE
EDGES. THE ACTUAL POSITION OF EACH BALL IS WITHIN 0.004 (0.10)
OF ITS IDEAL POSITION RELATIVE TO THE BALL GRID.
0.035 (0.90) 0.006 (0.15) MAX
0.030 (0.75)
0.024 (0.60)
BALL DIAMETER
ORDERING GUIDE
Part Number
Case Temperature
Range
Instruction Rate
On-Chip
SRAM
Operating
Voltage
Package
Option
ADSP-21061KS-133
ADSP-21061KS-160
ADSP-21061KS-200
ADSP-21061LKS-160
ADSP-21061LKS-176
ADSP-21061LAS-160
ADSP-21061LAS-176
ADSP-21061LKB-160
ADSP-21061LKB-176
0°C to +85°C
0°C to +85°C
0°C to +85°C
0°C to +85°C
0°C to +85°C
–40°C Case to +85°C Case
–40°C Case to +85°C Case
0°C to +85°C
0°C to +85°C
33 MHz
40 MHz
50 MHz
40 MHz
44 MHz
40 MHz
44 MHz
40 MHz
44 MHz
1 Mbit
1 Mbit
1 Mbit
1 Mbit
1 Mbit
1 Mbit
1 Mbit
1 Mbit
1 Mbit
5V
5V
5V
3.3 V
3.3 V
3.3 V
3.3 V
3.3 V
3.3 V
MQFP
MQFP
MQFP
MQFP
MQFP
MQFP
MQFP
PBGA
PBGA
The package options are as follows: the ADSP-21061 (5 V) is available in the 240-lead thermally enhanced package and the ADSP-21061L (3.3 V) is available in the
240-lead standard (no heat slug) package, and 225-Ball PBGA.
REV. B
–47–