AD8270 查看數據表（PDF） - Analog Devices

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AD8270

Precision Dual-Channel Difference Amplifier

Analog Devices 

Data Sheet

ABSOLUTE MAXIMUM RATINGS

Table 4.

Parameter

Supply Voltage

Output Short-Circuit Current

Input Voltage Range

Storage Temperature Range

Specified Temperature Range

Package Glass Transition Temperature (TG)

ESD

Human Body Model

Charge Device Model

Machine Model

Rating

±18 V

See derating

curve in Figure 2

±VS

−65°C to +130°C

−40°C to +85°C

130°C

1 kV

1 kV

0.1 kV

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Table 5. Thermal Resistance

Thermal Pad

θJA

Unit

16-Lead LFCSP with Thermal Pad

57

°C/W

Soldered to Board

16-Lead LFCSP with Thermal Pad

96

°C/W

Not Soldered to Board

The θJA values in Table 5 assume a 4-layer JEDEC standard

board with zero airflow. If the thermal pad is soldered to the

board, it is also assumed it is connected to a plane. θJC at the

exposed pad is 9.7°C/W.

AD8270

MAXIMUM POWER DISSIPATION

The maximum safe power dissipation for the AD8270 is limited

by the associated rise in junction temperature (TJ) on the die. At

approximately 130°C, which is the glass transition temperature,

the plastic changes its properties. Even temporarily exceeding this

temperature limit may change the stresses that the package exerts

on the die, permanently shifting the parametric performance of the

amplifiers. Exceeding a temperature of 130°C for an extended

period of time can result in a loss of functionality.

The AD8270 has built-in, short-circuit protection that limits the

output current to approximately 100 mA (see Figure 19 for more

information). While the short-circuit condition itself does not

damage the device, the heat generated by the condition can cause

the device to exceed its maximum junction temperature, with

corresponding negative effects on reliability.

3.2

TJ MAXIMUM = 130°C

2.8

2.4

PAD SOLDERED

2.0

θJA = 57°C/W

1.6

1.2

PAD NOT SOLDERED

0.8

θJA = 96°C/W

0.4

0

–50 –25

0

25

50

75

100 125

AMBIENT TEMPERATURE (°C)

Figure 2. Maximum Power Dissipation vs. Ambient Temperature

ESD CAUTION

Rev. A | Page 5 of 20

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