AD8206(2012) 查看數據表（PDF） - Analog Devices
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AD8206 Datasheet PDF : 16 Pages
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AD8206
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
Data Sheet
Figure 2. Metallization Diagram
–IN 1
8 +IN
GND 2 AD8206 7 VREF1
VREF2
3
TOP VIEW
(Not to Scale)
6
V+
NC 4
5 OUT
NC = NO CONNECT
Figure 3. Pin Configuration
Table 3. Pin Function Descriptions
Pin No.
Mnemonic
1
−IN
2
GND
3
VREF2
4
NC
5
OUT
6
V+
7
VREF1
8
+IN
Die size is 1245 µm by 1400 µm.
X
−209
−447
−432
N/A
+444
+444
+456
+207
Y
+486
+34
−480
N/A
−495
−227
+342
+486
Die thickness is 13 mil.
Minimum passivation opening (minimum bond pad size)
is 92 µm × 92 µm.
Passivation type is 8KA USG (Oxide) + 10KA Oxynitride.
Bond pad metal composition is 98.5% Al, 1% Si, and 0.5% Cu.
Backside potential is V+.
Rev. B | Page 6 of 16
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