
Philips Semiconductors
VHF power transistor
PACKAGE OUTLINE
Flanged ceramic package; 2 mounting holes; 4 leads
Product specification
BLV21
SOT123A
D
A
F
q
C
U1
B
H
4
α
1
H
w2 M C
L
b
3
A
p U2
w1 M A B
2
c
U3
Q
0
5
10 mm
scale
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
UNIT A
b
c
D
D1
F
H
L
p
Q
q
U1 U2 U3 w1 w2
α
mm
7.47
6.37
5.82
5.56
0.18
0.10
9.73
9.47
9.63
9.42
2.72 20.71 5.61
2.31 19.93 5.16
3.33
3.04
4.63
4.11
18.42
25.15
24.38
6.61
6.09
9.78
9.39
0.51 1.02
45°
inches
0.294
0.251
0.229
0.219
0.007
0.004
0.383
0.373
0.397
0.371
0.107
0.091
0.815
0.785
0.221
0.203
0.131
0.120
0.182
0.162
0.725
0.99
0.96
0.26
0.24
0.385
0.370
0.02
0.04
OUTLINE
VERSION
IEC
SOT123A
REFERENCES
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
97-06-28
August 1986
10