WED3EG7218S403JD3 查看數據表（PDF） - White Electronic Designs Corporation

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WED3EG7218S403JD3

128MB – 16Mx72 DDR SDRAM UNBUFFERED

White Electronic Designs Corporation 

White Electronic Designs

Document Title

128MB – 16Mx72 DDR SDRAM UNBUFFERED

DRAM DIE OPTIONS:

• SAMSUNG: H-Die

• MICRON: T26Z: G-Die

Revision History

Rev #

Rev A

Rev 0

History

Created Datasheet

0.1 Updated IDD and CAP specs

0.2 Updated AC specs

0.3 Moved from Advanced to Preliminary

0.4 Added Lead-Free and RoHS note

Rev 1

Rev 2

1.0 Added JEDEC PCB option (JD3)

1.1 D3 PCB option "NOT RECOMMENDED FOR NEW

DESIGNS"

2.1 Removed "D3" package option

2.2 Added "Part Numbering Guide"

2.3 Added DRAM die options

2.4 Added DDR400 and DDR333 ICC & AC specifications

WED3EG7218S-JD3

PRELIMINARY

Release Date Status

3-6-02

Advanced

11-04

Preliminary

11-05

6-06

Preliminary

Preliminary

June 2006

Rev. 2

12

White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

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