FBGA DEVICE MARKING
Due to the size of the package, Micron’s standard
part number is not printed on the top of each device.
Instead, an abbreviated device mark comprised of a
five-digit alphanumeric code is used. The abbreviated
device marks are cross referenced to Micron part num-
bers in Table 1.
DBFCF
256Mb: x4, x8, x16
SDRAM
Speed Grade
F = -75
N = -7E
Width ( I/Os)
B = x4
C = x8
D = x16
Device Density
H = 256Mb
Product Type
B = 3.3V SDR SDRAM (60-ball, "FB", 8mm x 16mm)
W = 3.3V SDR SDRAM (54-ball, "FG", 8mm x 14mm)
Product Group
D = DRAM
Z = DRAM ENGINEERING SAMPLE
CROSS REFERENCE FOR FBGA DEVICE MARKING
PART NUMBER
MT48LC64M4A2FB-75
MT48LC64M4A2FB-7E
MT48LC32M8A2FB-75
MT48LC32M8A2FB-7E
MT48LC16M16A2FG-75
MT48LC16M16A2FG-7E
ARCHITECTURE
64 Meg x 4
64 Meg x 4
32 Meg x 8
32 Meg x 8
16 Meg x 16
16 Meg x 16
FBGA
60-ball, 8x16mm
60-ball, 8x16mm
60-ball, 8x16mm
60-ball, 8x16mm
54-ball, 8x14mm
54-ball, 8x14mm
ENGINEERING
SAMPLE
ZBHBF
ZBHBN
ZBHCF
ZBHCN
ZWHDF
ZWHDN
PRODUCTION
MARKING
DBHBF
DBHBN
DBHCF
DBHCN
DWHDF
DWHDN
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
E-mail: prodmktg@micron.com, Internet: http://www.micron.com, Customer Comment Line: 800-932-4992
Micron is a registered trademark and the Micron logo and M logo are trademarks of Micron Technology, Inc.
256Mb: x4, x8, x16 SDRAM
256MSDRAM_E.p65 – Rev. E; Pub. 3/02
62
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2002, Micron Technology, Inc.