JANHCC1N5550US 查看數據表（PDF） - Unspecified

零件编号

产品描述 (功能)

生产厂家

JANHCC1N5550US

SEMICONDUCTOR DEVICE, DIODE,SILICON, POWER, RECTIFIER

Unspecified 

MIL-PRF-19500/420H

5. PACKAGING

* 5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or

order (see 6.2). When actual packaging of materiel is to be performed by DoD or in-house contractor personnel,

these personnel need to contact the responsible packaging activity to ascertain packaging requirements. Packaging

requirements are maintained by the Inventory Control Point's packaging activities within the Military Service or

Defense Agency, or within the Military Service’s system commands. Packaging data retrieval is available from the

managing Military Department's or Defense Agency's automated packaging files, CD-ROM products, or by

contacting the responsible packaging activity.

6. NOTES

(This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.)

6.1 Intended use. The notes specified in MIL-PRF-19500 are applicable to this specification.

* 6.2 Acquisition requirements. Acquisition documents should specify the following:

a. Title, number, and date of this specification.

b. Packaging requirements (see 5.1).

c. Lead finish (see 3.4.1).

d. Product assurance level and type designator.

6.3 Qualification. With respect to products requiring qualification, awards will be made only for products which

are, at the time of award of contract, qualified for inclusion in Qualified Manufacturers List (QML 19500) whether or

not such products have actually been so listed by that date. The attention of the contractors is called to these

requirements, and manufacturers are urged to arrange to have the products that they propose to offer to the Federal

Government tested for qualification in order that they may be eligible to be awarded contracts or orders for the

products covered by this specification. Information pertaining to qualification of products may be obtained from

Defense Supply Center, Columbus, ATTN: DSCC/VQE, P.O. Box 3990, Columbus, OH 43216-5000 or e-mail

vqe.chief@dla.mil.

6.4 Supersession information. Devices covered by this specification supersede the manufacturers' and

users' Part or Identifying Number (PIN). This information in no way implies that the manufacturers' PIN's

are suitable as a substitute for the military PIN.

6.5 Applications data. See figure 13 for maximum power in watts as a function of lead temperature at a

distance "L" from the diode body. Device current capability with lead-dissipators or body forced-air-cooling,

may be determined from figure 14, which shows maximum average rectified current versus lead

temperature as a function of the distance L from the diode body at which lead temperature is measured.

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