HCTS574K/SAMPLE 查看數據表（PDF） - Intersil

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HCTS574K/SAMPLE

Radiation Hardened Octal D-Type Flip-Flop, Three-State, Positive Edge Triggered

Intersil 

Die Characteristics

DIE DIMENSIONS:

101 x 85 mils

METALLIZATION:

Type: SiAl

Metal Thickness: 11kÅ ± 1kÅ

GLASSIVATION:

Type: SiO2

Thickness: 13kÅ ± 2.6kÅ

WORST CASE CURRENT DENSITY:

<2.0 x 105A/cm2

BOND PAD SIZE:

100µm x 100µm

4 mils x 4 mils

Metallization Mask Layout

D0

(2)

HCTS574MS

HCTS574MS

OE

VCC

Q0

(1)

(20)

(19)

D1 (3)

D2 (4)

D3 (5)

D4 (6)

D5 (7)

D6 (8)

(18) Q1

(17) Q2

(16) Q3

(15) Q4

(14) Q5

(13) Q6

(9)

(10)

(11)

(12)

D7

GND

CP

Q7

NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.

The mask series for the HCTS574 is TA14460A.

Spec Number 518629

703

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